8 Jobs für Thin Film Engineer in Baden-Württemberg
Stellenangebote Thin Film Engineer in Baden-Württemberg Jobs
Job vor 3 Tagen bei Jobleads gefunden
• Stuttgart, Baden- Württemberg
Location: Stuttgart, Germany Type: Fulltime hybrid (12 days remote work per week) Level: Principal/ Distinguished
Engineer or Architect Your Mission The future of AI computing is light, not electrons. is [...]
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[...] building photonic processing systems that compute with light, delivering a scalable, energyefficient alternative to transistorbased architectures for nextgeneration AI and HPC applications. As Principal ASIC Architect Photonic AI Processors you will define the architecture of our [. .. ] systems. Its Light Empowered Native Arithmetics (LENA) architecture delivers analog coprocessing power optimized for complex computation and enabling energyefficient performance for nextgeneration AI and HPC applications. It operates its own Thin Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS and is currently shipping its Native Processing Servers to selected partners. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart, Germany. #J-18808-Ljbffr 72368742 [. .. ]
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Job am 24.11.2025 bei Jobleads gefunden
• Stuttgart, Baden- Württemberg
[. .. ] this job and more exclusive features. Direct message the job poster from Q. ANT Location: Stuttgart, Germany Type: Full-time, hybrid (12 days remote work per week) Level: [...]
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[...] Principal/ Distinguished Engineer or Architect Your mission The future of AI computing is light, not electrons. Q. ANT is building photonic processing systems that compute with light delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. As Principal ASIC Architect Photonic AI Processors, you will [. .. ] Empowered Native Arithmetics (LENA) architecture delivers analog co-processing power optimized for complex computation and enables energy-efficient performance for next-generation AI and HPC applications. We operate our own Thin-Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart, IMS CHIPS, and are currently shipping our Native Processing Servers to selected partners. Why now matters: AI data centers are projected to consume 17 of US electricity by 2030. A single GPU now draws as much [. .. ]
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Job vor 2 Tagen bei Jobleads gefunden
• Stuttgart, Baden- Württemberg
Absolventen, Einsteiger, Trainees
A deep-tech innovator working on next-generation photonic computing is looking for a Junior Characterization
Engineer to join their fast-growing R D team. If youre passionate about optics, precision testing, and [...]
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[...] want to work with cutting-edge materials like Thin-Film Lithium Niobate (TFLN) , this could be the ideal next step in your career. The Role Youll play a key role in testing and validating photonic integrated circuits (PICs) and optical modules. Working closely with the design and process teams, youll be responsible for delivering accurate test data that supports [. .. ]
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Job am 22.11.2025 bei Jobleads gefunden
• Stuttgart, Baden- Württemberg
Senior
Engineer for Photonic Module Characterization Join to apply for the Senior Engineer for Photonic Module Characterization role at Q. ANT This role is enabling next generation analysis and characterizations [...]
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[...] of thinfilm lithium niobate (TFLN) structures, photonic integrated circuits (PICs) and modules operating in the GHz regime. Systemonchip measurements and electrooptical characterizations [. .. ] Its Light Empowered Native Arithmetics (LENA) architecture delivers analog coprocessing power optimised for complex computation and enabling energyefficient performance for nextgeneration AI and HPC applications. Q. ANT operates its own Thin Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart, IMS CHIPS, and is currently shipping its Native Processing Servers to selected partners. Founded by Michael Förtsch in 2018, it is headquartered in Stuttgart, Germany. Seniority Level Mid Senior level Employment Type Fulltime Job Function Data [. .. ]
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Job am 15.11.2025 bei Jobleads gefunden
• Stuttgart, Baden- Württemberg
Senior Photonic Integrated Circuit (PIC) Characterization
Engineer To lead the photonic and electrical characterization of thinfilm lithium niobate (TFLN) photonic integrated circuits (PICs) operating in the GHz regime. This role [...]
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[...] defines, develops, and operates advanced lab setups, including probe stations and test instrumentation, to extract performance metrics, identify improvement opportunities, and provide feedback to design and manufacturing. [. .. ] in GHzregime highspeed testing. Proven track record in setting up and optimizing optical RF probe stations for PIC measurements. Experience mentoring or supervising junior engineers in lab environments. Technical Knowledge Thin-film lithium niobate device physics and applications. High-speed optical modulation, detection, and RF signal integrity principles. Measurement instrumentation (VNAs, high-speed oscilloscopes, optical spectrum analyzers, RF probes, tunable lasers) . Calibration methods for optical and RF systems. Tools Processes Automation scripting (Python, Lab VIEW, MATLAB) . Data acquisition systems and post-[. .. ]
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Job am 26.09.2025 bei Jobleads gefunden
Senior Engineer for Photonic Module Characterization
• Stuttgart, Baden- Württemberg
Your mission This role is enabling next generation analysis and characterizations of
thin-film lithium niobate (TFLN) structures, photonic integrated circuits (PICs) and modules operating in the GHz regime. System-on-chip measurements [...]
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[...] and electrooptical characterizations for photonic-modules enable the development, integration and verification of essential building blocks for our core products and demos. This role is combined with responsibilities for PIC labs. [. .. ]
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Job am 26.09.2025 bei Jobleads gefunden
Senior Photonic Integrated Circuit (PIC) Characterization Engineer
• Stuttgart, Baden- Württemberg
Your mission To lead the photonic and electrical characterization of
thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) operating in the GHz regime. This role defines, develops, and operates advanced [...]
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[...] lab setups, including probe stations and test instrumentation, to extract performance metrics, identify improvement opportunities, and provide feedback to design and manufacturing. The engineer ensures high-quality measurement data, optimizes test procedures, and mentors junior engineers and operators. Key responsibilities Oversee daily characterization activities, ensuring high-quality, reproducible results. Define, design, build, and maintain optical and RF test setups, including probe station configuration, calibration, and optimization. Interface with design teams to understand device specifications [. .. ]
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Job vor 3 Tagen bei Neuvoo gefunden
Q. ANT GmbH
• Stuttgart, Baden- Württemberg
[. .. ] is building photonic processing systems that compute with light delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. As Senior Photonics Packaging [...]
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[...] Engineer (f/m/d) , you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs) , light sources, photodetectors, and analog circuitry into production-ready modules. Youll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, [. .. ] Native Arithmetics (LENA) architecture delivers analog co-processing power optimised for complex computation and enabling energy-efficient performance for next-generation AI and HPC applications. Q. ANT operates its own Thin-Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart, IMS CHIPS, and is currently shipping its Native Processing Servers to selected partners. Q. ANT was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart, Germany. 72427647 [. .. ]
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Häufig gestellte Fragen
Wieviel verdient man als Thin film engineer pro Jahr?
Als Thin film engineer verdient man zwischen EUR 50.000,- bis EUR 75.000,- im Jahr.
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Aktuell gibt es auf JobRobot 8 offene Stellenanzeigen für Thin Film Engineer Jobs in Baden-Württemberg.
Zu welchem Berufsfeld gehören Thin Film Engineer Jobs in Baden-Württemberg?
Thin Film Engineer Jobs in Baden-Württemberg gehören zum Berufsfeld Chemie.